JPS50106581A - - Google Patents
Info
- Publication number
- JPS50106581A JPS50106581A JP1145574A JP1145574A JPS50106581A JP S50106581 A JPS50106581 A JP S50106581A JP 1145574 A JP1145574 A JP 1145574A JP 1145574 A JP1145574 A JP 1145574A JP S50106581 A JPS50106581 A JP S50106581A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1145574A JPS50106581A (en]) | 1974-01-29 | 1974-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1145574A JPS50106581A (en]) | 1974-01-29 | 1974-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50106581A true JPS50106581A (en]) | 1975-08-22 |
Family
ID=11778558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1145574A Pending JPS50106581A (en]) | 1974-01-29 | 1974-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50106581A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842243A (ja) * | 1981-09-07 | 1983-03-11 | Hitachi Cable Ltd | 半導体素子用支持電極板 |
| JPS59145040U (ja) * | 1983-03-16 | 1984-09-28 | 三菱電機株式会社 | モノリシツクマイクロ波集積回路用キヤリヤ |
| JPS62174341U (en]) * | 1986-04-25 | 1987-11-05 |
-
1974
- 1974-01-29 JP JP1145574A patent/JPS50106581A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5842243A (ja) * | 1981-09-07 | 1983-03-11 | Hitachi Cable Ltd | 半導体素子用支持電極板 |
| JPS59145040U (ja) * | 1983-03-16 | 1984-09-28 | 三菱電機株式会社 | モノリシツクマイクロ波集積回路用キヤリヤ |
| JPS62174341U (en]) * | 1986-04-25 | 1987-11-05 |